Research Catalog

Title

Materials, processes, integration and reliability in advanced interconects for micro- and nanoelectronics : symposium held April 10-12, 2007, San Francisco, California, U.S.A. / editors: Qinghuang Lin [and others].

Publication

Warrendale, Penn. : Materials Research Society, [2007], ©2007.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Lin, Qinghuang, 1963-
• Materials Research Society. Fall Meeting (2007 : San Francisco, Calif.)
• Symposium on Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics s (2007 : San Francisco, Calif.)

Description

xiv, 338 pages : illustrations; 24 cm.

Series Statement

Materials Research Society symposium proceedings, 1067-9995 ; v. 990

Uniform Title

Materials Research Society symposia proceedings ; v. 990.

Subjects

• Materials > Congresses
• Integrated circuits > Very large scale integration > Congresses
• Interconnects (Integrated circuit technology) > Congresses
• Microelectronics > Congresses
• Nanoelectronics > Congresses

Note

• "Symposium B, 'Materials, Processes, Integration and Reliability in Advanced Inteconnects for Micro- and Nanoelectronics,' the MRS 'interconnect symposium'," [was] held April 10-12 at the 2007 MRS Spring Meeting in San Francisco, California ..."--Pref.

Bibliography (note)

• Includes bibliographical references and indexes.

Contents

• Formation of Porous Organosilicate Glasses Produced by PECVD and UV Treatment / Patrick T. Hurley, Lin-Shu Du, Paula L. McDaniel, Brian K. Peterson, Scott J. Weigel, Mary K. Haas, Raymond N. Vrtis, Dino Sinatore, Mark D. Bitner, Kathleen E. Theodorou and Mark L. O'Neill -- Requirements and Constraints on Optimizing UV Processing of Low-k Dielectrics / Ivan L. Berry III, Carlo Waldfried and Kevin Durr -- The Role of Pore Characterization in the Challenge to Integrate Porous Low-k Dielectrics / David W. Gidley, Richard S. Vallery and Ming Liu -- The Effect of Ultraviolet Light Curing on the Material and Fracture Properties of a k[is similar to]2.5 Low-k Dielectric / Ryan Scott Smith, Ting Tsui and Paul S. Ho -- Structural Transformation in PECVD Ultralow-k Material During Porogen Removal by UV Assisted Thermal Curing / Aziz Zenasni, Vincent Jousseaume, Olivier Gourhant, Laurent Favennec, Patrick Maury and Lucile Mage -- Penetration of Tagged Organics Into Caulked and Un-Caulked Porous Dielectrics Measured by Rutherford Backscattering / Robert D. Geil, Jay J. Senkevich and Bridget R. Rogers -- Extendibility of the PECVD Porogen Approach for ULK Materials / Olivier Gourhant, Vincent Jousseaume, Laurent Favennec, Aziz Zenasni, Patrick Maury, Lucile Mage, Patrice Gonon and Gilbert Vincent -- Effect of CH[subscript 4] Plasma Treatment on O[subscript 2] Plasma Ashed Organosilicate Low-k Dielectrics / Hualiang Shi, Junjing Bao, Junjun Liu, Huai Huang, Paul S. Ho, Michael D. Goodner, Mansour Moinpour and Grant M. Kloster -- Effects of Environment on Modulus of Low-k Porous Films Used in Back End of Line / Eva E. Simonyi, Christos D. Dimitrakopoulos, Michael Lane, Eric Liniger and Willi Volksen -- The Impact of Dielectric Films and Post-Metal Etch Wet Treatment on Charge-Induced Corrosion of Tungsten Vias / Szetsen Lee and Chi-Jung Ni -- Laser Thermoreflectance Measurement for Evaluating Heat Capacity and Interface Heat Resistance of Low-k Films / Jiping Ye, Takeo Okamura and Shigeo Sato -- Process Optimization of UV Curing for Ultra Low-k Dielectrics and High-Stress SiN Liners / Masazumi Matsuura, Kinya Goto, Shinobu Hashii, Noriko Miura, Yoshihiro Miyagawa, Tatsunori Murata, Yoshikazu Tsunemine and Koyu Asai -- Interface Stability of Metal Barrier and Low-k Dielectrics / T.-M. Lu, Y. Ou and P.-I. Wang -- Chemical Routes to Ultra Thin Films for Copper Barriers and Liners / John Ekerdt, Jinhong Shin, Wyatt Winkenwerder, Hyun-Woo Kim, Kelly Thom, Gyeong S. Hwang, Kyriacos Agapiou and Richard A. Jones -- Activation of Low-k Dielectric Surfaces for ALD Barrier Formation / Junjun Liu, Junjing Bao, Hualiang Shi and Paul S. Ho -- Characterization of Atomic Layer Deposited Ultrathin HfO[subscript 2]Film as a Diffusion Barrier in Cu Metallization / Prodyut Majumder, Rajesh Katamreddy and Christos G. Takoudis -- Low Temperature CVD of Ru from C[subscript 6]H[subscript 8]Ru(CO)[subscript 3] / Teresa S. Lazarz, Yu Yang, Navneet Kumar, Do Young Kim, Wontae Noh, Gregory S. Girolami and John R. Abelson -- Laser-Induced Microstructural Modification of Polycrystalline Cu and Ag Films Encapsulated in SiO[subscript 2] / Rong Zhong, Jorg M. K. Wiezorek and John P. Leonard -- Height Dependent Resistivity of Copper Interconnects in the Size Effect / Hideki Kitada, Takashi Suzuki, Takahiro Kimura and Tomoji Nakamura -- Study of Fatigue Behavior of 300 nm Damascene Interconnect Using High Amplitude AC Tests / David Read, Roy Geiss and Glenn Alers -- Electrical and Structural Properties of Ruthenium Film Grown by Atomic Layer Deposition Using Liquid-Phase Ru(CO)[subscript 3](C[subscript 6]H[subscript 8]) Precursor / Sung-Hoon Chung, Vladislav Vasilyev, Evgeni Gorokhov, Yong-Won Song and Hyuk-Kyoo Jang -- Time Evolution of Nanoscale Surface Topography of Tungsten Carbide Coatings on "Hot" Silicon Carbide Electronics Devices / Claudiu Muntele, Daniel Walker, Abdalla Elsamadicy and Daryush ILA -- Enhanced |111| Preferred Orientation of Ag Thin Film on Amorphous SiO[subscript 2] by Cu Addition / Yeongseok Zoo, Hauk Han and Terry L. Alford -- Texture Evolution and Stress in Silver Thin Films on Different Substrates Using X-ray Diffraction / Yeongseok Zoo and Terry L. Alford -- A Study of Tungsten-Titanium Barriers in Silver Metallization / S. Bhagat, N. D. Theodore and T. L. Alford -- Porosity and Its Effect on Barrier Performance of Thin Electroless Cobalt Alloy Caps / Qingyun Chen, Jun Liu, Elizabeth Walker, Richard Hurtubise, Daniel Stritch and Xuan Lin -- Electroless Deposition of Gold Nanoparticles Over Silicon-Based Substrates / Hassan Borteh, Nick Ferrell, Randall Butler, Susan Olesik and Derek Hansford -- Smooth Ag Film Deposited Using e-Beam Evaporated Ge as an Intermediate Layer for Applications in Nanoscale Devices and Optical Superlens / Logeeswaran Vj, Nobuhiko P. Kobayashi, Wei Wu, M. Saif Islam, Nicholas Xuanlai Fang, Shih Yuan Wang and R. Stanley Williams -- Surface Deformation of Metal Films Under Controlled Pressure for Generating Ultra-Flat Metal Surfaces / Logeeswaran Vj, Mei-Lin Chan, M. Saif Islam, David A. Horsley, Wei Wu, Shih Yuan Wang and R. Stanley Williams -- Texture Evolution in Cu Films and Lines / Chia-Jeng Chung, David Field, No-Jin Park and Christy Woo -- Potential of Ag Interconnect and Contact Metallization for Various Applications via Cu Additions / Hauk Han, Yeongseok Zoo, James W. Mayer and Terry L. Alford -- Evaluation of Copper Oxide to Copper Selectivity of Chemical Systems for BEOL Cleaning Through Electrochemical Investigations / Nandini Venkataraman, Ashok Kumar Muthukumaran and Srini Raghavan -- Electrochemical Corrosion Inhibition System for Photoresist Stripper for New Copper FPD Manufacturing / Seiji Inaoka and Sang In Kim -- Copper Chemical Vapor Deposition Using a Novel Cu(II) Precursor for Contact via Filling Process / Hideaki Zama, Yuuji Nishimura, Michiyo Yago and Mikio Watanabe -- A Trial for Micro-Scale Evaluation of Adhesion Strength Around Cu Metallization Systems / Shoji Kamiya, Hitoshi Arakawa, Hiroshi Shimomura and Masaki Omiya -- Charging and Aging Effects in Porous ULK Dielectrics / Cyril Guedj, Eugenie Martinez and Gregory Imbert -- Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films / Yaoyu Pang and Rui Huang -- Improved Electromigration Lifetime for Copper Interconnects Using Tantalum Implant / Jeff Gambino, Timothy D. Sullivan, Jason Gill, Fen Chen, Steve Mongeon, Edward D. Adams, Jay Burnham, Phil Pokrinchak and Kenneth P. Rodbell -- Direct Local Strain Measurement in Damascene Interconnects / Moustafa Kasbari, Christian Rivero, Sylvain Blayac, Florian Cacho, Ola Bostrom and Roland Fortunier -- Wafer Level Chip Size Packaging Technology for Bulk Acoustic Wave Filters / Hajime Yamada, Naoko Aizawa, Hiroyuki Fujino, Yoshihiro Koshido and Yukio Yoshino -- Improvement of LDI BUMP Stripping Process by Development of Room Temperature PR Stripper / Young-Sam Lim, Dong Chan Bae, Hyun-Joon Kim, Young-Nam Kim, Young Ho Kim and Tae Sung Kim -- Fatigue of Damascene Copper Lines Under AC Loading / Stephane Moreau, Sylvain Maitrejean and Gerard Passemard -- Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability / Aditya Karmarkar, Xiaopeng Xu, Dipu Pramanik, Xi-Wei Lin, Greg Rollins and Xiao Lin -- Assembly of Fine-Pitch Carbon Nanotube Bundles for Electrical Interconnect Applications / Lingbo Zhu, Dennis W. Hess and ChingPing Wong -- Dielectrophoresis-Based Assembly and High-Frequency Characterization of Carbon Nanotube Bundles / Michael Woodson, Alexander Tselev and Jie Liu -- Low Temperature Direct Metal Bonding by Self Assembled Monolayers / Xiaofang Ang, Li Cheong Chin, Guo Ge Zhang, Jun Wei, Zhong Chen and Chee Cheong Wong -- A Low Temperature Photonic Crystal Technology for Integration with Modern CMOS Technologies / Khadijeh Bayat, Mahdi Farrokh Baroughi, Sujeet K. Chaudhuri and Safieddin Safavi-Naeini --
• Sol-Gel Process Derived Superhydrophobic Silica Thin Films for Antistiction of MEMS Devices / Yonghao Xiu, Lingbo Zhu, Dennis W. Hess and C. P. Wong -- Engineered Solder-Directed Self-Assembly Across Length Scales / Robert Knuesel, Shameek Bose, Wei Zheng and Heiko O. Jacobs -- Nano-Scale Conductive Films for High Performance Fine Pitch Interconnect / Yi Li, Myung Jin Yim, Kyung Sik Moon and ChingPing Wong -- NanoCT: Visualizing of Internal 3D-Structures with Submicrometer Resolution / Oliver Brunke, Dirk Neuber and David K. Lehmann.

ISBN

• 9781558999503
• 1558999507

OCLC

• ocn173609050
• 173609050
• SCSB-5367917

Owning Institutions

Columbia University Libraries