Research Catalog
Integrated interconnect technologies for 3D nanoelectronic systems
- Title
- Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors.
- Publication
- Boston, Mass. ; London : Artech House, [2009], ©2009.
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| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Request in advance | TK7874.53 .I56 2009g | Off-site |
Holdings
Details
- Additional Authors
- Description
- xx, 528 pages : illustrations; 26 cm.
- Summary
- "Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale SoC. This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source." "You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects. The volume spells out the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and various types of carbon nanotube interconnects, along with coverage of wafer-level testing and probe substrates that features probe modules for testing GSI chips. Supported by 100 illustrations and featuring up-to-date physical models and experimental research in all I/O interconnect technologies essential to 3D GSI/TSI realization, this groundbreaking book offers practical guidance to help you achieve next-generation system-on-a-chip performance."--BOOK JACKET.
- Series Statement
- Integrated microsystems series
- Uniform Title
- Artech House integrated microsystems series.
- Subjects
- Bibliography (note)
- Includes bibliographical references and index.
- ISBN
- 9781596932463
- 1596932465
- OCLC
- ocn302063121
- 243546919
- 302063121
- SCSB-5452144
- Owning Institutions
- Columbia University Libraries