Research Catalog

Title

Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices / Ungyu Paik, Jea-Gun Park.

Author

Paik, Ungyu.

Publication

Boca Raton, FL : CRC Press/Taylor & Francis Group, [2009], ©2009.

Items in the Library & Off-site

Holdings

Details

Additional Authors

Park, Jea-Gun.

Description

xiii, 191 pages, 14 unnumbered pages of plates : illustrations (some color); 25 cm

Summary

"In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology." "Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems."--BOOK JACKET.

Subjects

• Chemical mechanical planarization
• Nanoparticles
• Nanoelectronics

Bibliography (note)

• Includes bibliographical references (p. 171-175) and index.

Contents

1. Overview of CMP Technology -- 2. Interlayer Dielectric CMP -- 3. Shallow Trench Isolation CMP -- 4. Copper CMP -- 5. Nanotopography -- 6. Novel CMP for Next-Generation Devices.

ISBN

• 9781420059113 (hardcover : alk. paper)
• 1420059114 (hardcover : alk. paper)

LCCN

• 2008051282
• 40016486820

OCLC

• ocn277040881
• 277040881
• SCSB-5461250

Owning Institutions

Columbia University Libraries