Research Catalog

Title

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A. / editors: F. Roozeboom [and others].

Publication

Warrendale, Pa. : Materials Research Society, 2009.

Items in the Library & Off-site

Holdings

Details

Additional Authors

• Roozeboom, Fred.
• Materials Research Society. Fall Meeting (2008 : Boston, Mass.)
• Symposium E, "Materials and technologies for 3-D Integration" (2008 : Boston, Mass.)

Description

xiii, 273 pages : illustrations; 24 cm.

Series Statement

MRS proceedings ; v. 1112

Uniform Title

Materials Research Society symposia proceedings ; v. 1112.

Subjects

• Three-dimensional imaging > Materials > Congresses
• Three-dimensional imaging > Congresses
• Three-dimensional display systems > Congresses
• Integrated circuits > Materials > Congresses
• Integrated circuits > Wafer-scale integration > Congresses
• Image processing > Digital techniques > Congresses
• Computer graphics > Congresses
• Three-dimensional display systems > Materials > Congresses

Note

• "... Symposium E... 2008 MRS Fall Meeting in Boston, Massachusetts" -- p. xii.

Bibliography (note)

• Includes bibliographical references and index.

Contents

3D Process Integration - Requirements and Challenges / M. Juergen Wolf, Armin Klumpp, Kai Zoschke, Robert Wieland, Lars Nebrich, Matthias Klein, Hermann Oppermann, Peter Ramm, Oswin Ehrmann and Herbert Reichl -- Three-Dimensional Integration Technology for Advanced Focal Planes / Craig L. Keast, Brian Aull, James Burns, Chenson Chen, Jeff Knecht, Brian Tyrrell, Keith Warner, Bruce Wheeler, Vyshi Suntharalingam, Peter Wyatt and Donna Yost -- Current and Future 3D-LSI Technology for the Image Sensor Devices / Makoto Motoyoshi, Hirofumi Nakamura, Manabu Bonkohara and Mitsumasa Koyanagi -- Scalability and Low Cost of Ownership Advantages of Direct Bond Interconnect (DBI) as Drivers for Volume Commercialization of 3D Integration Architectures and Applications / Paul Enquist -- 3D Wafer Level Packaging: Processes and Materials for Through-Silicon Vias and Thin Die Embedding / Philippe Soussan, Deniz Sabuncuoglu Tezcan, Francois Iker, Wouter Ruythooren, Bart Swinnen, Bivragh Majeed and Eric Beyne -- Wafer and Die Bonding Technologies for 3D Integration / Shari Farrens -- 3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces / Jian-Qiang Lu, J. J. McMahon and Ronald J. Gutmann -- 3D Vertical Interconnects by Copper Direct Bonding / Lea DiCioccio, Pierric Gueguen, Patrice Gergaud, Marc Zussy, Dominique Lafond, Jean Pierre Gonchond, Maurice Rivoire, Daniel Scevola and Laurent Clavelier -- Ambient Copper-Copper Thermocompression Bonding Using Self-Assembled Monolayers / Xiaofang Ang, Jun Wei, Zhong Chen and Chee Cheong Wong -- Effect of Temperature and Bonding Duration on the Mechanical Strength of Metal-to-Metal Thermocompression Bonds / Riko K. Made, Chee Lip Gan and Liling Yan -- Fabrication and Characterization of Metal-to-Metal Interconnect Structures for 3D Integration / Alan Huffman, John Lannon, Matthew Lueck, Christopher Gregory and Dorota Temple -- Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking / Takafumi Fukushima, Tetsu Tanaka and Mitsumasa Koyanagi -- Bosch Process - DRIE Success Story, New Applications and Products / Andrea Urban and Franz Laermer -- The Effect of Process Parameters on Electrical Properties of High Density Through-Si Vias / Patrick Leduc, Myriam Assous, David Bouchu, Antonio Roman, Michel Heitzmann, Barbara Charlet, Lea DiCioccio, Marc Zussy, Lucile Mage, Laurent Vandroux, Emmanuel Deronzier, Anne Roule, Paul-Henri Haumesser and Nicolas Sillon -- Front End of Line Through Silicon Via (TSV) Integration / Subhash L. Shinde, Todd M. Bauer, Jordan E. Massad and Dale L. Hetherington -- Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits / Aleksandar Radisic, Ole Luhn, Bart Swinnen, Hugo Bender, Chris Drijbooms, Geert Doumen, Kristof Kellens, Wouter Ruythooren and Philippe M. Vereecken -- A Method for Die Thickness Reduction to sub-35 [actual symbol not reproducible]m / Jeffrey Thompson, Gary Tepolt, Livia Racz, Chris Rogers, Robert White and Vincent Manno -- Statistical Analysis of the Influence of Thinning Processes on the Strength of Silicon / Yu Yang, Ricardo Cotrin Teixeira, Philippe Roussel, Bart Swinnen, Bert Verlinden and Ingrid De Wolf -- Oxidized ALD-Deposited Titanium Nitride Films as a Low-Temperature Alternative for Enhancing the Wettability of Through-Silicon Via Sidewalls / Mohamed Saadaoui, Henk van Zeijl, Mai Hoa Pham, Harm Knoops, W. M. M. Kessels, M. van de Sanden, Fred Roozeboom, Yann Lamy, K. B. Jinesh, Wim Besling and P. M. Sarro -- Recent Technology and Material Developments in 3D Packaging and Assembly / Marc de Samber, Eric van Grunsven, Verard Kums, Anton van der Lugt and Hans de Vries -- Die-to-Wafer 3D Integration Technology for High Yield and Throughput / Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Yukifumi Oyama, Chirag S. Patel, Kuniaki Sueoka, Edmund J. Sprogis and John Knickerbocker -- 3D MEMS and IC Integration / Maaike M. Taklo, Nicolas Lietaer, Hannah R. Tofteberg, Timo Seppanen, Josef Prainsack, Josef Weber and Peter Ramm -- Hotspot-Optimized Interlayer Cooling in Vertically Integrated Packages / Thomas Brunschwiler, Bruno Michel, Hugo Rothuizen, Urs Kloter, Bernhard Wunderle and Herbert Reichl -- Design Support for 3D System Integration by Multi Physics Simulation / Peter Schneider, Sven Reitz, Joern Stolle, Roland Martin, Andreas Wilde, Peter Ramm and Josef Weber -- Through Silicon Via Metalization: A Novel Approach for Insulation/Barrier/Copper Seed Layer Deposition Based on Wet Electrografting and Chemical Grafting Technologies / Dominique Suhr, Jose Gonzalez, Isabelle Bispo, Frederic Raynal, Claudio Truzzi, Steve Lerner and Vincent Mevellec -- Characterization of Texture and Microstructure of Electrodeposited Ni Layers / Homuro Noda, Akinobu Shibata, Masato Sone, Chiemi Ishiyama and Yakichi Higo -- A Novel Method for the Growth of Low Temperature Silicon Structures for 3D Flash Memory Devices / Thomas A. Mih, Richard B. Cross and Shashi Paul.

ISBN

• 9781605110844
• 1605110841

OCLC

• ocn407067779
• 407067779
• SCSB-5478554

Owning Institutions

Columbia University Libraries