Research Catalog
Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
- Title
- Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / co-sponsored by the Applied Mechanics ... [et al.] Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME.
- Publication
- New York : American Society of Mechanical Engineers, c1994.
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3 Items
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
Not available - Please for assistance. | Text | Use in library | TK7870.15 .M43 1994 vol.1 | Off-site |
Not available - Please for assistance. | Text | Use in library | TK7870.15 .M43 1994 vol.2 | Off-site |
Not available - Please for assistance. | Text | Use in library | TK7870.15 .M43 1994 vol.3 | Off-site |
Holdings
Details
- Additional Authors
- Description
- 3 v. : ill.; 28 cm.
- Series Statement
- AMD ; vol. 187, 193, 195 (v. 1)
- Uniform Title
- AMD (Series) ; vol. 187.
- AMD (Series) ; vol. 193.
- AMD (Series) ; vol. 195.
- Subject
- Electronic packaging > Congresses
- Bibliography (note)
- Includes bibliographical references and indexes.
- Contents
- v. 1. Design and processes issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
- ISBN
- 0791814491 (v. 1)
- 0791814270 (v. 2)
- 0791814424 (v. 3)
- LCCN
- 94079149
- Owning Institutions
- Princeton University Library