Research Catalog

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Title
CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
Publication
New York, N.Y. : American Society of Mechanical Engineers, c1997.

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Details

Additional Authors
  • Agonafer, D.
  • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. http://id.loc.gov/authorities/names/n92020291
  • International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
Description
v, 109 p. : ill.; 28 cm.
Series Statement
  • EEP ; vol. 23
  • HTD ; vol. 356
Uniform Title
  • EEP (Series) ; vol. 23.
  • HTD (Series) ; vol. 356.
Subject
  • Computer-aided design > Congresses
  • Computer-aided engineering > Congresses
  • Electronic apparatus and appliances > Congresses
  • Electronic systems > Congresses
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0791818527
Owning Institutions
Princeton University Library