Research Catalog

Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /

Title
Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G.J. Kowalski ... [et al.].
Publication
New York, N.Y. : American Society of Mechanical Engineers, c2000.

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Details

Additional Authors
  • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. http://id.loc.gov/authorities/names/n92020291
  • International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.)
  • Kowalski, G. J. (Gregory Joseph)
  • Symposium on Mechanics of SMT and Photonic Structures (12th : 2000 : Orlando, Fla.)
Description
vi, 299 p. : ill.; 28 cm.
Series Statement
EEP ; vol. 28
Uniform Title
EEP (Series) ; vol. 28.
Subject
  • Electronic packaging > Congresses
  • Photonics > Congresses
  • Semiconductor wafers > Design and manufacture > Congresses
  • Solder and soldering > Congresses
  • Surface mount technology > Congresses
Bibliography (note)
  • Includes bibliographical references and author index.
Contents
12th Symposium on Mechanics of SMT and Photonic Structures -- Alternatives to lead solder : views, concerns, and issues in military electronics and other harsh environments. 1. Technical advances in lead-free interconnection technologies -- Research and technological advances in wafer and electronic manufacturing.
ISBN
0791819302
Owning Institutions
Princeton University Library