Research Catalog
Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /
- Title
- Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G.J. Kowalski ... [et al.].
- Publication
- New York, N.Y. : American Society of Mechanical Engineers, c2000.
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Not available - Please for assistance. | Text | Use in library | TK7870.15 .P335 2000 | Off-site |
Details
- Additional Authors
- American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. http://id.loc.gov/authorities/names/n92020291
- International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.)
- Kowalski, G. J. (Gregory Joseph)
- Symposium on Mechanics of SMT and Photonic Structures (12th : 2000 : Orlando, Fla.)
- Description
- vi, 299 p. : ill.; 28 cm.
- Series Statement
- EEP ; vol. 28
- Uniform Title
- EEP (Series) ; vol. 28.
- Subject
- Bibliography (note)
- Includes bibliographical references and author index.
- Contents
- 12th Symposium on Mechanics of SMT and Photonic Structures -- Alternatives to lead solder : views, concerns, and issues in military electronics and other harsh environments. 1. Technical advances in lead-free interconnection technologies -- Research and technological advances in wafer and electronic manufacturing.
- ISBN
- 0791819302
- Owning Institutions
- Princeton University Library