Research Catalog

Packaging, reliability and manufacturing issues associated with electronic and photonic products /

Title
Packaging, reliability and manufacturing issues associated with electronic and photonic products / presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York ; sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by Suresh Sitaraman ... [et al.].
Author
International Mechanical Engineering Congress and Exposition (2001 : New York, N.Y.)
Publication
New York, N.Y. : ASME, c2001.

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Details

Additional Authors
  • American Society of Mechanical Engineers. Electronic and Photonic Packaging Division. http://id.loc.gov/authorities/names/nr2001047614
  • Sitaraman, Suresh.
Description
vii, 305 p. : ill.; 28 cm.
Series Statement
EPP ; v. 1
Uniform Title
EPP (Series) ; v. 1.
Subjects
Bibliography (note)
  • Includes bibliographical references and index.
ISBN
0791835650
Owning Institutions
Princeton University Library