Research Catalog

Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado /

Title
Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.

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StatusFormatAccessCall NumberItem Location
TextUse in library TK7870.15 .M83 1993Off-site

Details

Additional Authors
  • International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.)
  • International Electronics Packaging Society. http://id.loc.gov/authorities/names/n86829716
  • International Society for Hybrid Microelectronics. http://id.loc.gov/authorities/names/n50037241
Description
x, 604 p. : ill.; 28 cm.
Series Statement
Proceedings ; v. 1986
Subjects
ISBN
0930815378
LCCN
94101200
Owning Institutions
Princeton University Library