Research Catalog
Stress induced phenomena in metallization : fifth international workshop, Stuttgart, Germany, June, 1999
- Title
- Stress induced phenomena in metallization : fifth international workshop, Stuttgart, Germany, June, 1999 / editors, Oliver Kraft [and others].
- Publication
- Melville, N.Y. : American Institute of Physics, ©1999.
Items in the Library & Off-site
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Use in library | TK7871.85 .S769 1999 | Off-site |
Details
- Additional Authors
- Description
- ix, 318 pages : illustrations; 25 cm
- Series Statement
- AIP conference proceedings, 1551-7616 ; no. 491
- Uniform Title
- AIP conference proceedings ; no. 491.
- Subject
- Integrated circuits > Defects > Congresses
- Thin film devices > Defects > Congresses
- Electrodiffusion > Congresses
- Metallic films > Congresses
- Electrochemical metallizing > Congresses
- Aluminum films > Congresses
- Semiconductors > Defects > Congresses
- Liquid crystal devices > Defects > Congresses
- Acoustic surface wave devices > Defects > Congresses
- Thermal stresses > Congresses
- Strains and stresses > Congresses
- Thermal stresses
- Strains and stresses
- Aluminum films
- Electrochemical metallizing
- Electrodiffusion
- Integrated circuits > Defects
- Metallic films
- Semiconductors > Defects
- Thin film devices > Defects
- Fisica geral
- Metallic films > Electric properties > Congresses
- Thin film devices > Congresses
- Liquid crystal devices > Congresses
- Aluminum films > Electric properties > Congresses
- Acoustic surface wave devices > Congresses
- Metallizing > Congresses
- Semiconducteurs > Couches minces > Congrès
- Microélectronique > Congrès
- Genre/Form
- Conference papers and proceedings
- Note
- "The International Workshop on Stress Induced Phenomena in Metallization"--Pref.
- Bibliography (note)
- Includes bibliographical references and indexes.
- Additional Formats (note)
- Also available in an electronic version.
- Contents
- Reliability of interconnects -- Fundamentals of electromigration.
- Reliability of interconnects -- Fundamentals of electromigration -- Microstructure and thermal stresses.
- ISBN
- 1563969041
- 9781563969041
- LCCN
- 99460336
- OCLC
- ocm42866326
- 42866326
- SCSB-928260
- Owning Institutions
- Princeton University Library