Research Catalog

Title

Stress-induced phenomena in metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 / editors, Paul S. Ho [and others].

Author

International Workshop on Stress-Induced Phenomena in Metallization (7th : 2004 : Austin, Tex.)

Publication

Melville, N.Y. : American Institute of Physics, 2004.

Items in the Library & Off-site

Details

Additional Authors

Ho, P. S.

Description

vii, 272 pages : illustrations; 25 cm

Series Statement

AIP conference proceedings, 0094-243X ; v. 741

Uniform Title

AIP conference proceedings ; no. 741.

Alternative Title

Seventh International Workshop on Stress-Induced Phenomena in Metallization

Subject

• Semiconductors > Defects > Congresses
• Integrated circuits > Defects > Congresses
• Interconnects (Integrated circuit technology) > Defects > Congresses
• Dielectric films > Defects > Congresses
• Metallic films > Defects > Congresses
• Thin film devices > Defects > Congresses
• Copper > Electric properties > Congresses
• Metallizing > Congresses
• Electrodiffusion > Congresses
• Damascening > Congresses
• Metallic films > Congresses
• Aluminum films > Congresses
• Metallic films
• Aluminum films
• Copper > Electric properties
• Damascening
• Electrodiffusion
• Integrated circuits > Defects
• Metallizing
• Semiconductors > Defects
• Thin film devices > Defects
• Semicondutores (congressos)

Genre/Form

Conference papers and proceedings

Note

• "Held at the University of Texas at Austin"--Preface

Bibliography (note)

• Includes bibliographical references and indexes.

Additional Formats (note)

• Also available in an electronic version.

Contents

Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation.

ISBN

• 0735402256
• 9780735402256

LCCN

2004116273

OCLC

• ocm57340844
• 57340844
• SCSB-1355944

Owning Institutions

Princeton University Library