Research Catalog
Solder joint technology : materials, properties, and reliability
- Title
- Solder joint technology : materials, properties, and reliability / King-Ning Tu.
- Author
- Tu, K. N. (King-Ning), 1937-
- Publication
- New York : Springer, ©2007.
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Use in library | TA492.W4 T844 2007 | Off-site |
Details
- Description
- xvi, 368 pages : illustrations; 25 cm
- Series Statement
- Springer series in materials science ; 92
- Uniform Title
- Springer series in materials science ; 92.
- Subject
- Bibliography (note)
- Includes bibliographical references and index.
- Contents
- Introduction.- Cu-Sn reaction in bulk samples.- Cu-Sn reaction in thin film samples. Cu-Sn reaction in flip chip solder joints and electromigration.- Kinetic analysis of flux-driven ripening of Cu-Sn scallops.- Polarity effect of electromigration on solder reactions.- Ductile?to-brittle transition of solder joints affected by Cu-Sn reactions.- Spontaneous Sn whisker growth on Cu leadframe finished with Pb-free.- Comparison to solder reactions on other metals.
- ISBN
- 9780387388908
- 0387388907
- 0387388923
- 9780387388922
- 1441922849
- 9781441922847
- LCCN
- 2007921097
- 9780387388908
- OCLC
- ocn123113661
- 123113661
- SCSB-9186900
- Owning Institutions
- Princeton University Library