Research Catalog
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993
- Title
- Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993 / editors, Paul S. Ho, Che-Yu Li, Paul Totta.
- Author
- International Workshop on Stress-Induced Phenomena in Metallization (2nd : 1993 : University of Texas at Austin)
- Publication
- New York : American Institute of Physics, ©1994.
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1 Item
| Status | Format | Access | Call Number | Item Location |
|---|---|---|---|---|
| Text | Use in library | TK7871.85 .S766 1994 | Off-site |
Details
- Additional Authors
- Description
- vii, 302 pages : illustrations; 25 cm
- Series Statement
- AIP conference proceedings ; no. 305
- Uniform Title
- AIP conference proceedings ; no. 305.
- Subject
- Semiconductors > Defects > Congresses
- Integrated circuits > Defects > Congresses
- Interconnects (Integrated circuit technology) > Defects > Congresses
- Metallic films > Defects > Congresses
- Thin film devices > Defects > Congresses
- Aluminum films > Defects > Congresses
- Metallizing > Congresses
- Electrodiffusion > Congresses
- Strains and stresses > Congresses
- Strains and stresses
- Electrodiffusion
- Integrated circuits > Defects
- Metallizing
- Semiconductors > Defects
- Thin film devices > Defects
- Genre/Form
- Conference papers and proceedings
- Note
- "DOE CONF-9303142"--T.p. verso.
- Bibliography (note)
- Includes bibliographical references and index.
- Additional Formats (note)
- Also available in an electronic version.
- Contents
- Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T.N. Marieb, E. Abratowski, J.C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M.A. Korhonen, P. Borgesen, D.D. Brown, C.-Y. Li, T.D. Sullivan and P.A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P.R. Besser and J.C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P.S. Ho, I.-S. Yeo, S.G.H. Anderson and C.K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T.D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G.M. Zorn.
- ISBN
- 1563962519
- 9781563962516
- LCCN
- 94070650
- OCLC
- ocm30564183
- 30564183
- SCSB-2026732
- Owning Institutions
- Princeton University Library