Research Catalog

Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

Title
Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
Publication
Bellingham, Wash. : Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, c1993.

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Details

Additional Authors
  • International Society for Hybrid Microelectronics.
  • International Electronics Packaging Society.
  • International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.)
Description
x, 604 p. : ill.; 28 cm.
Series Statement
Proceedings ; v. 1986
Uniform Title
Proceedings of SPIE--the International Society for Optical Engineering ; v. 1986.
Subject
  • Multichip modules (Microelectronics) > Congresses
  • Electronic packaging > Congresses
  • Microelectronic packaging > Congresses
Note
  • Papers from the Second International Conference and Exhibition on Multichip Modules.
Bibliography (note)
  • Includes bibliographical references.
ISBN
0930815378
LCCN
94101200
OCLC
  • ocm30032036
  • SCSB-2034373
Owning Institutions
Princeton University Library