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  • Handbook of electronic package design / edited by Michael Pecht.

    • Text
    • New York : Marcel Dekker, c1991.
    • 1991
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 91-911Offsite

  • Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.

    • Text
    • New York : Wiley, c1994.
    • 1994
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 94-1207Offsite

  • Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.].

    • Text
    • New York : Wiley, c1994.
    • 1994
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 95-1391Offsite

  • Placement and routing of electronic modules / edited by Michael Pecht.

    • Text
    • New York : M. Dekker, c1993.
    • 1993
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 94-1551Offsite

  • Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.

    • Text
    • New York : Wiley, c1995.
    • 1995
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 95-1466Offsite

  • Physical architecture of VLSI systems / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.

    • Text
    • New York : Wiley, c1994.
    • 1994
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 95-377Offsite

  • The Korean electronic industry / Michael Pecht ... [et al.].

    • Text
    • Boca Raton : CRC Press, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text JBE 97-834Offsite

  • The Taiwan electronics industry / Chung-Shing Lee, Michael Pecht.

    • Text
    • Boca Raton, Fla. : CRC Press, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text JBE 97-835Offsite

  • The Singapore and Malaysia electronics industry / Donald Beane, Anand Shukla, Michael Pecht.

    • Text
    • Boca Raton : CRC Press, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text JBE 97-833Offsite

  • The Japanese electronics industry / Wataru Nakayama, William Boulton, Michael Pecht.

    • Text
    • Boca Raton, Fla. : Chapman & Hall/CRC Press, c1999.
    • 1999
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 99-1637Offsite

  • Parts selection and management / edited by Michael G. Pecht.

    • Text
    • Hoboken, N.J. : Wiley-Interscience, c2004.
    • 2004
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 04-250Offsite

  • IC component sockets / Weifeng Liu, Michael Pecht.

    • Text
    • Hoboken, N.J. : Wiley-Interscience, c2004.
    • 2004
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 04-28Offsite

  • Lead-free electronics / edited by Sanka Ganesan, Michael Pecht.

    • Text
    • Hoboken, N.J. : Wiley-Interscience, c2006.
    • 2006
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 06-507Offsite

  • The Chinese electronics industry / Michael Pecht ... [et al.].

    • Text
    • Boca Raton, Fla. : CRC Press, c1999.
    • 1999
    • 1 Item
    FormatCall NumberItem Location
    Text JBE 10-1800Schwarzman Building - General Research Room 315
    Request for On-site UseRequest Scan

    Available - Can be used on site. Please visit New York Public Library - Schwarzman Building to submit a request in person.

  • Placement and routing of electronic modules / edited by Michael Pecht.

    • Text
    • New York : M. Dekker, [1993], ©1993.
    • 1993-1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7868.P7 P57 1993Off-site

  • Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.

    • Text
    • New York : Wiley, [1994], ©1994.
    • 1994-1994
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .P42 1994Off-site

  • Quality conformance and qualification of microelectronic packages and interconnects / editors, Michael Pecht [and others].

    • Text
    • New York : Wiley, [1993], ©1993.
    • 1993-1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .Q35 1994Off-site

  • Physical architecture of VLSI systems / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.

    • Text
    • New York : Wiley, [1994], ©1994.
    • 1994-1994
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .P49 1994Off-site

  • Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.

    • Text
    • New York : Wiley, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .P428 1995Off-site

  • Product reliability, maintainability, and supportability handbook / edited by Michael Pecht ; ARINC Research Corporation.

    • Text
    • Boca Raton : CRC Press, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870 .P748 1995Off-site

  • Advanced routing of electronic modules / edited by Michael G. Pecht and Yeun Tsun Wong.

    • Text
    • Boca Raton, Fla. : CRC Press, 1996.
    • 1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7868.P7 A38 1996Off-site

  • Electronic packaging materials and their properties / Michael G. Pecht [and others].

    • Text
    • Boca Raton : CRC Press, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .E4222 1999Off-site

  • The Japanese electronics industry / Wataru Nakayama, William Boulton, Michael Pecht.

    • Text
    • Boca Raton, Fla. : Chapman & Hall/CRC Press, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text HD9696.A3 J36754 1999Off-site

  • The Chinese electronics industry / Michael Pecht [and others].

    • Text
    • Boca Raton, Fla. : CRC Press, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text HD9696.A3 C5232 1999Off-site

  • Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.

    • Text
    • New York : American Society of Mechanical Engineers, c1993.
    • 1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .E424 1993Off-site

  • Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.

    • Text
    • New York : American Society of Mechanical Engineers, c1993.
    • 1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .E424 1993Off-site

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