Research Catalog

  • Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1995.
    • 1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .I573 1995Off-site

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