Research Catalog

  • I-THERM V : May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A. / co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) ... [et al.].

    • Text
    • [New York] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : IEEE Service Center [distributor], c1996.
    • 1996
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 96-648Offsite
  • ITherm'98 : the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998 / edited by Sushil H. Bhavnani, Gary B. Kromann, Douglas J. Nelson.

    • Text
    • Piscataway, New Jersey : IEEE, 1998.
    • 1998
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 98-559Offsite
  • ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.

    • Text
    • Piscataway, New Jersey : IEEE, 2000.
    • 2000
    • 2 Items
    FormatCall NumberItem Location
    Text JSF 00-1055 v. 1Offsite
    FormatCall NumberItem Location
    Text JSF 00-1055 v. 2Offsite
  • Heat sink effects on weld bead [microform] : VPPA process / Paul O. Steranka, Jr.

    • Text
    • Wichita, Kan. : National Institute for Aviation Research, Wichita State University ; [Washington, DC : National Aeronautics and Space Administration ; Springfield, Va. : National Technical Information Service, distributor, 1990]
    • 1990
  • ITherm 2002 : ITherm 2002 is the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : presented at San Diego, California, USA, May 30-June 1, 2002 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ... [et al.] ; edited by C.H. Amon ... [et al.].

    • Text
    • Piscataway, New Jersey : IEEE, 2002.
    • 2002
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 02-721Offsite
  • Heat convection in micro ducts / Yitshak Zohar.

    • Text
    • Boston ; London : Kluwer Academic Publishers, c2003.
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 02-2064Offsite
  • ITherm 2004 : the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : Mirage Hotel & Casino, Las Vegas, NV, June 1-June 4, 2004 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ... [et al.] ; co-sponsored by American Society of Mechanical Engineers ... [et al.] ; edited by Koneru Ramakrishna ... [et al.].

    • Text
    • Piscataway, N.J. : IEEE, c2004.
    • 2004
    • 2 Items
    FormatCall NumberItem Location
    Text JSF 04-538 v. 1Offsite
    FormatCall NumberItem Location
    Text JSF 04-538 v. 2Offsite
  • Silicon microchannel heat sinks : theories and phenomena / L. Zhang, K.E. Goodson, T.W. Kenney.

    • Text
    • Berlin : New York : Springer, c2004.
    • 2004
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 06-1175Offsite
  • Analysis of ultimate-heat-sink spray ponds / R. Codell.

    • Text
    • Washington, D.C. : Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission, August 1981.
    • 1981-8
    • 1 Resource

    Available Online

    https://purl.fdlp.gov/GPO/gpo80620
  • Design and analysis of heat sinks / Allan D. Kraus, Avram Bar-Cohen.

    • Text
    • New York : J. Wiley, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 K69 1995Off-site
  • I-THERM V : May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A. / co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) [and others].

    • Text
    • [New York] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : IEEE Service Center [distributor], [1996], ©1996.
    • 1996-1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25 .I56 1996Off-site
  • ITherm'98 : the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998 / edited by Sushil H. Bhavnani, Gary B. Kromann, Douglas J. Nelson.

    • Text
    • Piscataway, New Jersey : IEEE, 1998.
    • 1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25 .I56 1998gOff-site
  • ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.

    • Text
    • Piscataway, New Jersey : IEEE, 2000.
    • 2000
    • 2 Items
    FormatCall NumberItem Location
    Text TK7870.25 .I6 2000g v.2Off-site
    FormatCall NumberItem Location
    Text TK7870.25 .I6 2000g v.1Off-site
  • ITherm 2002 : ITherm 2002 is the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : presented at San Diego, California, USA, May 30-June 1, 2002 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) [and others] ; edited by C.H. Amon [and others].

    • Text
    • Piscataway, New Jersey : IEEE, 2002.
    • 2002
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25 .I6 2002gOff-site
  • Heat convection in micro ducts / Yitshak Zohar.

    • Text
    • Boston : Kluwer Academic, [2003], ©2003.
    • 2003-2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 Z64 2003Off-site
  • First International Conference on Microchannels and Minichannels : presented at the First International Conference on Microchannels and Minichannels, April 24-25, 2003, Rochester, New York / sponsored by the American Society of Mechanical Engineers, ASME, the Rochester Institute of Technology ; principal editor, S.G. Kandlikar ; contributing editors, G.P. Celata ... [et al.].

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c2003.
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text QC319.8 .I56 2003Off-site
  • Silicon microchannel heat sinks : theories and phenomena / L. Zhang, K.E. Goodson, T.W. Kenney.

    • Text
    • Berlin ; New York : Springer, [2004], ©2004.
    • 2004-2004
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 Z43 2003Off-site
  • CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1994.
    • 1994
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 C332 1994Off-site
  • Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1996.
    • 1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 A664 1996Off-site
  • ITherm'98 : the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electric Systems : Seattle, Washington, USA, May 27-30, 1998 / edited by Sushil H. Bhavnani, Gary B. Kromann, Douglas J. Nelson.

    • Text
    • Piscataway, New Jersey : IEEE, c1998.
    • 1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25.I574 1998Off-site
  • ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.

    • Text
    • 2000
    • 2 Items
    FormatCall NumberItem Location
    Text TK7870.25 .I574 2000 vol.2Off-site
    FormatCall NumberItem Location
    Text TK7870.25 .I574 2000 vol.1Off-site
  • Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006 : presented at 4th International Conference on Nanochannels, Microchannels and Minichannels, June 19-21, 2006, Limerick, Ireland / sponsored by ASME.

    • Text
    • New York : American Society of Mechanical Engineers, c2006.
    • 2006
    • 2 Items
    FormatCall NumberItem Location
    Text TJ260 .I5745 2006 Pt.BOff-site
    FormatCall NumberItem Location
    Text TJ260 .I5745 2006 Pt. AOff-site
  • Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007 : presented at 5th International Conference on Nanochannels, Microchannels and Minichannels, June 18-20, 2007, Puebla, Mexico / sponsored by ASME.

    • Text
    • New York : American Society of Mechanical Engineers, c2007.
    • 2007
    • 1 Item
    FormatCall NumberItem Location
    Text TJ260 .I5745 2007Off-site
  • Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels-- 2008 : presented at 6th International Conference on Nanochannels, Microchannels and Minichannels, June 23-25, 2008, Darmstadt, Germany ; sponsored by ASME.

    • Text
    • New York : American Society of Mechanical Engineers, c2008.
    • 2008
    • 2 Items
    FormatCall NumberItem Location
    Text TJ260 .I5745 2008 Pt.BOff-site
    FormatCall NumberItem Location
    Text TJ260 .I5745 2008 Pt.AOff-site
  • Heat transfer : thermal management of electronics / Younes Shabany.

    • Text
    • Boca Raton : CRC Press, c2010.
    • 2010
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25 .S53 2010Off-site
  • ITherm 2000 : the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000 / sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gary B. Kromann, J. Richard Culham, Koneru Ramakrishna.

    • Text
    • Piscataway, N.J. : IEEE, 2000.
    • 2000
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25 .I574 2000 vol.1Off-site
  • Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells / Ho Sung Lee.

    • Text
    • Hoboken, NJ : Wiley, ©2010.
    • 2010
    • 1 Item
    FormatCall NumberItem Location
    Text TJ255.5 .L44 2010Off-site
  • Proceedings of the ASME 11th International Conference on Nanochannels, Microchannels, and Minichannels, --2013 ; presented at ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, June 16-19, 2013, Sapporo, Japan ; sponsored by ASME.

    • Text
    • New York, N.Y. : ASME, c2013.
    • 2013
    • 1 Item
    FormatCall NumberItem Location
    Text TJ260 .I5745 2013Off-site
  • Proceedings of the ASME 12th International Conference on Nanochannels, Microchannels, and Minichannels--2014.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, 2014.
    • 1 Item
    FormatCall NumberItem Location
    Text TJ260 .I5745 2014Off-site
  • Proceedings of the ASME 13th International Conference on Nanochannels, Microchannels, and Minichannels 2015 : presented at ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, July 6-9, 2015, San Francisco, California, USA.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, 2015.
    • 1 Item
    FormatCall NumberItem Location
    Text TJ260 .I574 2015Off-site

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