Research Catalog

  • Excitation of space charge waves and their effect on the electric impedance of thin semiconductor wafers.

    • Text
    • Trondheim, Norges tekniske høgskole, 1972.
    • 1972
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 74-728Offsite
  • SEMICON/West, May 20-22, 1986, San Mateo, California : process and equipment reliability in the fab environment / presented by Semiconductor Equipment and Materials Institute, Inc.

    • Text
    • Mountain View, Calif. : The Institute, [1986?]
    • 1986
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 88-563Offsite
  • Handbook of semiconductor wafer cleaning technology : science, technology, and applications / edited by Werner Kern.

    • Text
    • Park Ridge, N.J., U.S.A. : Noyes Publications, c1993.
    • 1993
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 94-776Offsite
  • Wafer fabrication : factory performance and analysis / Linda F. Atherton, Robert W. Atherton.

    • Text
    • Boston : Kluwer Academic Publishers, c1995.
    • 1995
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 96-825Offsite
  • Semiconductor wafer bonding : science and technology / Q.-Y. Tong, U. Gosele.

    • Text
    • New York ; Chichester [England] : John Wiley, c1999.
    • 1999
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 99-176Offsite
  • Techniques and challenges for 300 mm silicon : processing, characterization, modelling and equipment : proceedings of Symposium F on Techniques and Challenges for 300 mm Silicon of the E-MRS 1998 Spring Conference, Strasbourg, France, 16-19 June 1998 / edited by H. Richter, P. Wagner, G. Ritter.

    • Text
    • Amsterdam ; New York : Elsevier, 1999.
    • 1999
    • 1 Item
    FormatCall NumberItem Location
    Text JSF 01-893Offsite
  • Semiconductor measurement technology [microform] : evolution of silicon materials characterization : lessons learned for improved manufacturing / W. Murray Bullis ; prepared for Semiconductor Electronics Division, Electronics and Electrical Engineering Laboratory, National Institute of Standards and Technology"

    • Text
    • Gaithersburg, MD : U.S. Dept. of Commerce, National Institute of Standards and Technology ; Washington, D.C. : For sale by the Supt. of Docs., U.S. G.P.O., 1993.
    • 1993
  • National security assessment of the U.S. semiconductor wafer processing equipment industry [microform].

    • Text
    • [Washington, D.C.] : U.S. Dept. of Commerce, Bureau of Export Administration, Office of Strategic Industries and Economic Security, Strategic Analysis Division : [Supt. of Docs., U.S. G.P.O., distributor, 1991]
    • 1991
  • SEM Sentinel [microform] : SEM performance measurement system / Alice V. Ling ... [et al.].

    • Text
    • Gaithersburg, MD : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, [2000-
    • 2000-present
  • Workshop on temperature measurement of semiconductor wafers using thermocouples [microform] / K.G. Kreider ... [et al., editors].

    • Text
    • Gaithersburg, MD : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, [2001]
    • 2001
  • Wafer bonding : applications and technology / M. Alexe, U. Gösele (eds.).

    • Text
    • Berlin ; New York : Springer-Verlag, c2004.
    • 2004
    • 1 Item
    FormatCall NumberItem Location
    Text JSE 04-1202Offsite
  • Apparatus for edge etching of semiconductor wafers [microform] / Casajus, A.

    • Text
    • Washington, D.C. : National Aeronautics and Space Administration, [1986]
    • 1986
  • Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.

    • Text
    • Adelphi, MD : Army Research Laboratory, September 2014.
    • 2014-9
    • 1 Resource

    Available Online

    https://purl.fdlp.gov/GPO/gpo61207
  • A Framework for standard modular simulation : application to semiconductor wafer fabrication / Heshan Li [and others].

    • Text
    • [Gaithersburg, MD] : U.S. Dept. of Commerce, National Institute of Standards and Technology, [2005]
    • 2005
    • 1 Resource

    Available Online

    https://purl.fdlp.gov/GPO/gpo95707
  • Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Ulrich Gösele ... [and others ; sponsored by the] Electronics and Dielectric Science and Technology divisions.

    • Text
    • Pennington, NJ : Electrochemical Society, [1992], ©1992.
    • 1992-1992
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5838 1991Off-site
  • Proceedings of the Second International Symposium on Cleaning Technology in Semiconductor Device Manufacturing / edited by Jerzy Ruzyllo, Richard E. Novak ; [sponsored by the] Electronics and Dielectric Science and Technology divisions.

    • Text
    • Pennington, NJ : Electrochemical Society, [1992], ©1992.
    • 1992-1992
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5824 1992Off-site
  • Handbook of semiconductor wafer cleaning technology : science, technology, and applications / edited by Werner Kern.

    • Text
    • Park Ridge, N.J., U.S.A. : Noyes Publications, [1993], ©1993.
    • 1993-1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .H335 1993Off-site
  • Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Martin A. Schmidt ... [and others ; sponsored by the] Electronics and Dielectric Science and Technology divisions.

    • Text
    • Pennington, NJ : Electrochemical Society, [1993], ©1993.
    • 1993-1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5838 1993gOff-site
  • Proceedings of the Third International Symposium on Cleaning Technology in Semiconductor Device Manufacturing / edited by Jerzy Ruzyllo, Richard E. Novak ; assistant editors, A. Bowling [and others] ; [sponsored by the] Electronics and Dielectric Science and Technology Divisions.

    • Text
    • Pennington, NJ : Electrochemical Society, [1994], ©1994.
    • 1994-1994
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5824 1993Off-site
  • Proceedings of the Symposium on Large Area Wafer Growth and Processing for Electronic and Photonic Devices and the Twentieth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XX) / edited by D.N. Buckley, S.A. Ringel, F. Ren.

    • Text
    • Pennigton, NJ : The Electrochemical Society, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .S959 1994Off-site
  • IEEE/UCS/SEMI International Symposium on Semiconductor Manufacturing / sponsored by the IEEE Electron Devices Society, and the Components Packaging & Manufacturing Technology Society and the Ultra Clean Society.

    • Text
    • [New York, N.Y.] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : Additional copies may be purchased from IEEE Service Center, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I131 1995gOff-site
  • Proceedings of the Symposium on Nondestructive Wafer Characterization for Compound Materials and the twenty-second State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXII) / Edited by V. Swaminathan[and others].

    • Text
    • Pennington, NJ : Electrochemical Society, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.99.C65 S96 1995gOff-site
  • Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications / organizers/editors, C.E. Hunt [and others].

    • Text
    • Pennington, NJ : Electrochemical Society, [1995], ©1995.
    • 1995-1995
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5838 1995Off-site
  • Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing / editors, Richard E. Novak, Jerzy Ruzyllo ; assistant editors, A. Bowling [and others].

    • Text
    • Pennington, NJ : Electrochemical Society, [1996], ©1996.
    • 1996-1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5824 1995Off-site
  • 1996 1st International Symposium on Plasma Process-Induced Damage : 13-14 May 1996, Santa Clara, California, USA / Kim P. Cheung, Moritaka Nakamura, and Calvin T. Gabriel, editors ; technical co-sponsors, IEEE/Electron Devices Society, American Vacuum Society, Japanese Society of Applied Physics.

    • Text
    • Sunnyvale, CA : Northern California Chapter of the American Vacuum Society, [1996], ©1996.
    • 1996-1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 1996Off-site
  • Proceedings of the Fourth International Symposium on High Purity Silicon / editors, C.L. Claeys [and others].

    • Text
    • Pennington, NJ : Electrochemical Society, [1996], ©1996.
    • 1996-1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.86 .I58 1996Off-site
  • Flatness, roughness, and discrete defect characterization for computer disks, wafers, and flat panel displays : 8-9 August 1996, Denver, Colorado / John C. Stover, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash. : SPIE, [1996], ©1996.
    • 1996-1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .F53 1996gOff-site
  • 1997 2nd International Symposium on Plasma Process-Induced Damage : 13-14 May 1997, Monterey, California, USA / Kin P. Cheung, Moritaka Nakamura, and Calvin T. Gabriel, editors ; technical co-sponsors, IEEE/Electron Devices Society, American Vacuum Society, Japanese Society of Applied Physics.

    • Text
    • Sunnyvale, CA : Northern California Chapter of the American Vacuum Society, [1997], ©1997.
    • 1997-1997
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 1997gOff-site
  • Flatness, roughness, and discrete defects characterization for computer disks, wafers, and flat panel displays II : 29-30 January 1998, San Jose, California / John C. Stover, chair/editor ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash., USA : SPIE, [1998], ©1998.
    • 1998-1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .F62 1998gOff-site
  • High-density magnetic recording and integrated magneto-optics : materials and devices : symposium held April 12-16, 1998, San Francisco, California, U.S.A. / editors, James Bain [and others].

    • Text
    • Warrendale, Pa. : Materials Research Society, [1998], ©1998.
    • 1998-1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7895.M3 H54 1998Off-site
  • 1998 3rd International Symposium on Plasma Process-Induced Damage : June 4-5, 1998, Honolulu, Hawaii, USA / Moritaka Nakamura, Thuy Dao, and Terence Hook, editors ; technical co-sponsors, American Vacuum Society, IEEE/Electron Devices Society, Japanese Society of Applied Physics.

    • Text
    • Sunnyvale, California : Northern California Chapter of the American Vacuum Society, [1998], ©1998.
    • 1998-1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 1998gOff-site
  • Ultraclean surface processing of silicon wafers : secrets of VLSI manufacturing / Takeshi Hattori (ed.).

    • Text
    • Berlin ; New York : Springer, [1998], ©1998.
    • 1998-1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .U48 1998Off-site
  • Semiconductor wafer bonding : science and technology / Q.-Y. Tong, U. Gösele.

    • Text
    • New York : John Wiley, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .T66 1999Off-site
  • 1999 4th International Symposium on Plasma Process-Induced Damage : May 9-11, 1999, Monterey, California, USA / Thuy Dao, Mitsumasa Koyanagi, and Terence Hook, editors ; technical co-sponsors, IEEE/Electron Devices Society, American Vacuum Society, Japanese Society of Applied Physics.

    • Text
    • Sunnyvale, CA : Northern California Chapter of the American Vacuum Society, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 1999gOff-site
  • Surface characterization for computer disks, wafers, and flat panel displays : 28 January 1999, San Jose, California / John C. Stover, chair/editor ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash., USA : SPIE, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .S89 1999gOff-site
  • Plasma etching processes for sub-quarter micron devices : proceedings of the International Symposium / editor, G.S. Mathad ... [and others ; cosponsored by] Dielectric Science and Technology and Electronics Divisions [of the Electrochemical Society].

    • Text
    • Pennington, NJ : Electrochemical Society, [2000], ©2000.
    • 2000-2000
    • 1 Item
    FormatCall NumberItem Location
    Text TA2020 .P52 2000gOff-site
  • Semiconductor wafer bonding : science, technology, and applications V : proceedings of the International Symposia[sic] / editors, Charles E. Hunt [and others] ; Electronics Division [of the Electrochemical Society].

    • Text
    • Pennington, New Jersey : Electrochemical Society, [2001], ©2001.
    • 2001-2001
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5838 1999gOff-site
  • Electronics manufacturing issues : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee / sponsored by the Design Engineering Division, ASME ; edited by Chittaranjan Sahat [i.e. Sahay] [and others].

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, [1999], ©1999.
    • 1999-1999
    • 1 Item
    FormatCall NumberItem Location
    Text TK7836 .E466 1999gOff-site
  • 2000 5th International Symposium on Plasma Process-Induced Damage : May 22-24, 2000, Santa Clara, California, USA / Mitsumasa Koyanagi, Manfred Englehardt, and Calvin T. Gabriel, editors ; technical co-sponsors, American Vacuum Society, IEEE/Electron devices Society, Japanese Society of Applied Physics.

    • Text
    • Santa Clara, California : Northern California Chapter of the American Vacuum Society, [2000], ©2000.
    • 2000-2000
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 2000gOff-site
  • High purity silicon VI : proceedings of the Sixth International Symposium / editors, C.L. Claeys [and others] ; sponsored by: Electrochemical Society, Inc., Electronics Division ; published in cooperation with: SPIE--the International Society for Optical Engineering.

    • Text
    • Pennington, New Jersey : Electrochemical Society ; Bellingham, Washington : SPIE, [2000], ©2000.
    • 2000-2000
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.86 .I58 2000gOff-site
  • Advanced microelectronic processing techniques : 28-30 November 2000, Singapore / H. Barry Harrison, Andrew T.S. Wee, Subhash Gupta, chairs/editors ; sponsored by Nanyang Technological University (Singapore) [and] SPIE--the International Society for Optical Engineering ; cooperating organizations, Institute of Physics (Singapore) [and others].

    • Text
    • Bellingham, Wash., USA : SPIE, [2000], ©2000.
    • 2000-2000
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .A3484 2000gOff-site
  • 2001 6th International Symposium on Plasma- and Process-Induced Damage : May 13-15, 2001, Monterey, California, USA / Manfred Englehardt, Terence Hook, and and Calvin T. Gabriel, editors ; technical co-sponsors, American Vacuum Society, IEEE/Electron devices Society, Japanese Society of Applied Physics.

    • Text
    • Santa Clara, California : Northern California Chapter of the American Vacuum Society, [2001], ©2001.
    • 2001-2001
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 2001gOff-site
  • Design, process integration, and characterization for microelectronics : 6-7 March 2002, Santa Clara, USA / Alexander Starikov, Kenneth W. Tobin, Jr., chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash., USA : SPIE, [2002], ©2002.
    • 2002-2002
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .D47565 2002gOff-site
  • 2002 7th International Symposium on Plasma- and Process-Induced Damage : June 5-7, 2002, Maui, Hawaii, USA / Terence Hook, Koji Eriguchi, and Calvin T. Gabriel, editors ; technical co-sponsors, AVS, IEEE/Electron Devices Society, Japanese Society of Applied Physics.

    • Text
    • Santa Clara, California : AVS, [2002], ©2002.
    • 2002-2002
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 2002gOff-site
  • Automated scanning low-energy electron probe (ASLEEP) for semiconductor wafer diagnostics / A. Christou ; Naval Research Laboratory.

    • Text
    • Washington : Department of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off., 1978.
    • 1978
    • 1 Item
    FormatCall NumberItem Location
    Text C 13.10:400-30Off-site
  • A wafer chuck for use between -196 and 350C̊ / R. Y. Koyama and M. G. Beuhler, Electron Devices Division, Center for Electronics and Electrical Engineering, National Engineering Laboratory, National Bureau of Standards.

    • Text
    • Washington : Department of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off., 1979.
    • 1979
    • 1 Item
    FormatCall NumberItem Location
    Text C 13.10:400-55Off-site
  • 2002 8th International Symposium on Plasma- and Process-Induced Damage : April 24-25, 2003, Corbeil-Essonnes, France / Koji Eriguchi, S. Krishnan, and Terence Hook, editors ; [technical co-sponsors, IEEE/Electron Devices Society, Japanese Society of Applied Physics].

    • Text
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7871.85 .I5834 2003gOff-site
  • Process and materials characterization and diagnostics in IC manufacturing : 27-28 February 2003, Santa Clara, California, USA / Kenneth W. Tobin, Jr., Iraj Emami, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash., USA : SPIE, [2003], ©2003.
    • 2003-2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .P745 2003gOff-site
  • Design and process integration for microelectronic manufacturing II : 26-28 February 2003, Santa Clara, California, USA / Alexander Starikov, chair/editor ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .D377 2003gOff-site
  • Cost and performance in integrated circuit creation : 27-28 February 2003, Santa Clara, California, USA / Alfred K.K. Wong, Kevin M. Monahan, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

    • Text
    • Bellingham, Wash. : SPIE, c2003.
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .C67 2003gOff-site

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