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Displaying 1-4 of 4 results for author "Agonafer, D."
Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 / sponsored by the Heat Transfer Division, ASME ; edited by Dereje Agonafer.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .N38 1993 Off-site CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text TK7872.H4 C332 1994 Off-site Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1996.
- 1996
- 1 Item
Item details Format Call Number Item Location Text TK7872.H4 A664 1996 Off-site CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.25.C332 1997 Off-site
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