Research Catalog

  • Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 / sponsored by the Heat Transfer Division, ASME ; edited by Dereje Agonafer.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1993.
    • 1993
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .N38 1993Off-site
  • CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1994.
    • 1994
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 C332 1994Off-site
  • Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1996.
    • 1996
    • 1 Item
    FormatCall NumberItem Location
    Text TK7872.H4 A664 1996Off-site
  • CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.25.C332 1997Off-site

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