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Displaying 1-1 of 1 results for author "Ceramic Interconnect Initiative. http://id.loc.gov/authorities/names/no2003090697"
Proceedings : IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado / sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff].
- Text
- Bellingham, Wash., USA : SPIE, [2003], ©2003.
- 2003-2003
- 1 Item
Item details Format Call Number Item Location Text TK7872.15.C4 I43 2003g Off-site
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