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Displaying 1-1 of 1 results for author "International Electronics Packaging Society. http://id.loc.gov/authorities/names/n86829716"
Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
- Text
- 1993
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .M83 1993 Off-site
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