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Displaying 1-1 of 1 results for author "Jahsman, W. E. (William E.)"
Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.
- Text
- New York, N.Y. : The Society, [1991], ©1991.
- 1991-1991
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .M35 1991 Off-site
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