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Displaying 1-4 of 4 results for author "Sitaraman, Suresh."
Solder joint reliability prediction for multiple environments / by Andrew Eugene Perkins, Suresh K. Sitaraman.
- Text
- New York ; London : Springer, 2008.
- 2008
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .P47 2009g Off-site Packaging, reliability and manufacturing issues associated with electronic and photonic products / presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York ; sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by Suresh Sitaraman ... [et al.].
- Text
- New York, N.Y. : ASME, c2001.
- 2001
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .I585 2001 Off-site Solder joint reliability prediction for multiple environments / by Andrew Eugene Perkins, Suresh K. Sitaraman.
- Text
- New York ; London : Springer, 2008.
- 2008
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .P475 2009 Off-site Solder joint reliability prediction for multiple environments / by Andrew Eugene Perkins, Suresh K. Sitaraman.
- Text
- New York ; London : Springer, 2008.
- 2008
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .P475 2009 Off-site
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