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Displaying 1-1 of 1 results for author "International Thermal Conductivity Conference (33rd : 2017 : Logan, Utah)"
Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA / Heng Ban [editor].
- Text
- Lancaster, PA : DEStech Publications, [2018]
- 2018
- 1 Item
Item details Format Call Number Item Location Text QC320.8 .I58 2017g Off-site
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