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Displaying 1-11 of 11 results for author "American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. http://id.loc.gov/authorities/names/n92020291"
Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.
- Text
- New York : American Society of Mechanical Engineers, c1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .E424 1993 Off-site Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .I573 1995 Off-site Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text TK7870.25 .I573 1995 Off-site Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
- Text
- New York : American Society of Mechanical Engineers, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 S46 1995 Off-site Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.].
- Text
- New York : American Society of Mechanical Engineers, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .I584 1995 Off-site CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text TK7872.H4 C332 1994 Off-site Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1996.
- 1996
- 1 Item
Item details Format Call Number Item Location Text TK7872.H4 A664 1996 Off-site Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .A664 1997 Off-site CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.25.C332 1997 Off-site Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu.
- Text
- New York : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .A643 1997 Off-site Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G.J. Kowalski ... [et al.].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c2000.
- 2000
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .P335 2000 Off-site
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