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Displaying 1-50 of 140 results
Microelectronics interconnection and packaging / edited by Jerry Lyman.
- Text
- New York : McGraw-Hill, c1980.
- 1980
- 1 Item
Item details Format Call Number Item Location Text JSF 80-1115 Offsite Proceedings of the technical program / ... annual International Electronics Packaging Conference.
- Text
- Glen Ellyn, Ill. : International Electronics Packaging Society, 1981-
- 1981-present
- 1 Item
Item details Format Call Number Item Location Text JSP 87-42 1983 Offsite A Scientific guide to surface mount technology / by C. Lea.
- Text
- Ayr, Scotland : Electrochemical Publications, 1988.
- 1988
- 1 Item
Item details Format Call Number Item Location Text JSE 88-584 Offsite Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski.
- Text
- New York, N.Y. : Van Nostrand Reinhold, c1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JSE 89-839 Offsite Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989 / edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International.
- Text
- Metals Park, Ohio : ASM International, c1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JSF 90-819 Offsite The International journal of microcircuits and electronic packaging.
- Text
- Reston, VA : International Society for Hybrid Microelectronics, 1992-[2002?]
- 1992-2002
- 9 Items
Item details Format Call Number Item Location Text JSM 93-92 v. 23 (2000) Offsite Item details Format Call Number Item Location Text JSM 93-92 v. 24 (2001) Offsite Item details Format Call Number Item Location Text JSM 93-92 v. 25:1 (2002) Offsite Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A. / editors, Ephraim Suhir ... [et al.].
- Text
- Pittsburgh, Pa. : Materials Research Society, c1991.
- 1991
- 1 Item
Item details Format Call Number Item Location Text JSE 92-1897 Offsite Proceedings, 1993 IEEE Multi-Chip Module Conference, MCMC-93 : March 15-18, 1993, Santa Cruz, California / sponsored by IEEE Circuits and Systems Society ... [et al.].
- Text
- Los Alamitos, Calif. : IEEE Computer Society Press, c1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text JSF 93-624 Offsite Proceedings, 1994 IEEE Multi-Chip Module Conference, MCMC-94 : March 15-17, 1994, Santa Cruz, California / sponsored by IEEE Circuits and Systems Society ... [et al.].
- Text
- Los Alamitos, Calif. : IEEE Computer Society Press, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSF 94-501 Offsite Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.
- Text
- New York : Wiley, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1466 Offsite Proceedings of the technical program.
- Text
- Chicago, Ill. : Industrial and Scientific Conference Management
- 1963-198
- 11 Items
Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1976 Offsite Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1979 Offsite Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1981 Offsite Proceedings of the technical program / National Electronic Packaging and Production Conference.
- Text
- Des Plaines, IL : Cahners Exposition Group
- unknown-present
- 1 Item
Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1985 Offsite Polymer thick film / Ken Gilleo.
- Text
- New York : Van Nostrand Reinhold, c1996.
- 1996
- 1 Item
Item details Format Call Number Item Location Text JSF 96-67 Offsite Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 / Elsa Reichmanis ... [et al.], editor.
- Text
- Washington, DC : American Chemical Society, 1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text JSE 96-49 Offsite Optoelectronic packaging / edited by Alan R. Mickelson, Nagesh R. Basavanhally, Yung-Cheng Lee.
- Text
- New York : Wiley, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSE 97-722 Offsite Reliability of electronic packages and semiconductor devices / Giulio di Giacomo.
- Text
- New York : McGraw-Hill, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSE 97-705 Offsite Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / John H. Lau, Yi-hsin Pao.
- Text
- New York : McGraw-Hill, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSE 97-738 Offsite Fundamentals of microfabrication / Marc Madou.
- Text
- Boca Raton, Fla. : CRC Press, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSF 98-99 Offsite Multichip module technology handbook / Philip E. Garrou, Iwona Turlik.
- Text
- New York : McGraw-Hill, c1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text JSE 98-285 Offsite Microelectronic packaging; interconnection and assembly of integrated circuits [edited by] George Sideris.
- Text
- New York, McGraw-Hill [1968]
- 1968
- 1 Item
Item details Format Call Number Item Location Text TTE (Sideris, G. Microelectronic packaging) Offsite Proceedings.
- Text
- New York, Society of Automotive Engineers [c1968]
- 1968
- 1 Item
Item details Format Call Number Item Location Text TTE (Microelectronic Packaging Conference, Palo Alto, Calif., 1968. Proceedings) Offsite Advanced electronic packaging : with emphasis on multichip modules / edited by William D. Brown.
- Text
- New York : IEEE Press, c1999.
- 1999
- 1 Item
Item details Format Call Number Item Location Text JSF 99-162 Offsite Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.
- Text
- New York ; London : McGraw-Hill, c1999.
- 1999
- 1 Item
Item details Format Call Number Item Location Text JSE 99-696 Offsite Liquid cooling of electronic devices by single-phase convection / Frank P. Incropera.
- Text
- New York : Wiley, c1999.
- 1999
- 1 Item
Item details Format Call Number Item Location Text JSE 99-1672 Offsite The simulation of thermomechanically induced stress in plastic encapsulated IC packages / Gerard Kelly.
- Text
- Boston : Kluwer Academic Publishers, c1999.
- 1999
- 1 Item
Item details Format Call Number Item Location Text JSE 99-1862 Offsite Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / John H. Lau.
- Text
- New York ; London : McGraw-Hill, c2000.
- 2000
- 1 Item
Item details Format Call Number Item Location Text JSE 00-889 Offsite Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee.
- Text
- New York ; London : McGraw-Hill, c2001.
- 2001
- 1 Item
Item details Format Call Number Item Location Text JSE 01-1064 Offsite The effect of imports of ceramic semiconductor packages on the national security [microform] : an investigation conducted under section 232 of the Trade Expansion Act of 1962, as amended.
- Text
- [Washington, D.C.] : U.S. Dept. of Commerce, Bureau of Export Administration, Office of Strategic Industries and Economic Security, Strategic Analysis Division : [Supt. of Docs., U.S. G.P.O., distributor, 1993]
- 1993
Area array packaging handbook / Ken Gilleo.
- Text
- New York : McGraw-Hill, 2002.
- 2002
- 1 Item
Item details Format Call Number Item Location Text JSE 02-138 Offsite RF measurements of die and packages / Scott A. Wartenberg.
- Text
- Boston ; London : Artech House, c2002.
- 2002
- 1 Item
Item details Format Call Number Item Location Text JSE 02-1095 Offsite Area array packaging materials : adhesives, pastes, and lead-free / Ken Gilleo, editor.
- Text
- New York : McGraw-Hill, 2004.
- 2004
- 2 Items
Item details Format Call Number Item Location Text JSE 04-170 Offsite Item details Format Call Number Item Location Text JSE 04-181 Offsite MEMS packaging / editor, Tai-Ran Hsu.
- Text
- London : Institution of Electrical Engineers, 2003.
- 2003
- 1 Item
Item details Format Call Number Item Location Text JSF 04-224 Offsite IC component sockets / Weifeng Liu, Michael Pecht.
- Text
- Hoboken, N.J. : Wiley-Interscience, c2004.
- 2004
- 1 Item
Item details Format Call Number Item Location Text JSE 04-28 Offsite Journal of microelectronics and electronic packaging.
- Text
- Washington, DC : International Microelectronics and Packaging Society, 2004-
- 2004-present
- 3 Items
Item details Format Call Number Item Location Text JSM 04-171 v. 1-2 (2004-2005) Offsite Item details Format Call Number Item Location Text JSM 04-171 v. 3-4 (2006-2007) Offsite Item details Format Call Number Item Location Text JSM 04-171 v. 5 (2008) Offsite Proceedings of the technical programme / International Electronic Packaging and Production Conference.
- Text
- Surbiton, Surrey : Industrial and Scientific Conference Management, c1968-c1985.
- 1968-1985
- 8 Items
Item details Format Call Number Item Location Text JSP 77-491 1981 Offsite Item details Format Call Number Item Location Text JSP 77-491 1982 Offsite Item details Format Call Number Item Location Text JSP 77-491 1984 Offsite Advanced electronic packaging.
- Text
- Hoboken, NJ : Wiley ; Piscataway, NJ : IEEE, c2006.
- 2006
- 1 Item
Item details Format Call Number Item Location Text JSF 06-253 Offsite Not available - In use until 2024-01-26 - Please for assistance.Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand.
- Text
- Berlin ; New York : Springer, 2004.
- 2004
- 1 Item
Available Online
http://www.loc.gov/catdir/toc/fy054/2004110615.htmlItem details Format Call Number Item Location Text JSE 06-1498 Offsite Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan.
- Text
- New York : McGraw-Hill, c2008.
- 2008
- 1 Item
Item details Format Call Number Item Location Text JSE 08-373 Offsite Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.
- Text
- Adelphi, MD : Army Research Laboratory, September 2014.
- 2014-9
- 1 Resource
Available Online
https://purl.fdlp.gov/GPO/gpo61207Advanced packaging [electronic resource] : an IHS Group publication.
- Text
- Libertyville, Ill., USA : IHS Pub. Group, ©1992-
- 1992-present
- 2 Resources
Available Online
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Through-silicon vias for 3d integration / John H. Lau.
- Text
- New York : McGraw-Hill, [2013], ©2013.
- 2013-2013
- 1 Item
Item details Format Call Number Item Location Text TK7874.53 .L38 2013g Off-site Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A. / editors, Ephraim Suhir [and others].
- Text
- Pittsburgh, Pa. : Materials Research Society, [1991], ©1991.
- 1991-1991
- 1 Item
Item details Format Call Number Item Location Text TK7874 .M375 1991 Off-site Hermeticity testing of MEMS and microelectronic packages / Suzanne Costello, Marc P.Y. Desmulliez.
- Text
- Boston : Artech House, [2013]
- 2013
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .C67 2013g Off-site Multichip modules / edited by Ernest S. Kuh.
- Text
- Singapore ; River Edge, NJ : World Scientific, [1992], ©1992.
- 1992-1992
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .M846 1992g Off-site Multichip module technologies and alternatives : the basics / edited by Daryl Ann Doane, Paul D. Franzon.
- Text
- New York : Van Nostrand Reinhold, [1993], ©1993.
- 1993-1993
- 1 Item
Item details Format Call Number Item Location Text TK7874 .M864 1993 Off-site Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.
- Text
- New York, N.Y. : The Society, [1991], ©1991.
- 1991-1991
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .M35 1991 Off-site Multichip modules : international conference and exhibition : 14-16 April 1993, Denver, Colorado / sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
- Text
- Bellingham, WA : Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, [1993], ©1993.
- 1993-1993
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .I57 1993g Off-site Electronic packaging, microelectronics, and interconnection dictionary / Charles A. Harper, Martin B. Miller.
- Text
- New York : McGraw-Hill, [1993], ©1993.
- 1993-1993
- 1 Item
Item details Format Call Number Item Location Text TK7804 .H34 1993 Off-site Thermal stress and strain in microelectronics packaging / edited by John H. Lau.
- Text
- New York : Van Nostrand Reinhold, 1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .T48 1993 Off-site Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado / sponsored by ISHM--the Microelectronics Society [and others] in cooperation with SEMI--Semiconductor Equipment and Materials International.
- Text
- Reston, Va. : ISHM ; Wheaton, Ill. : International Electronics Packaging Society : Published in cooperation with SPIE--the International Society for Optical Engineering, [1994], ©1994.
- 1994-1994
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .M853 1994g Off-site
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