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Displaying 1-50 of 287 results
Design and packaging of electronic equipment / Joel L. Sloan.
- Text
- New York : Van Nostrand Reinhold Co., c1985.
- 1985
- 1 Item
Item details Format Call Number Item Location Text JSE 85-1988 Offsite Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. / editors, Edward A. Giess, King-ning Tu, Donald R. Uhlmann.
- Text
- Pittsburgh, Pa. : Materials Research Society, 1985.
- 1985
- 1 Item
Item details Format Call Number Item Location Text JSE 86-569 Offsite Electronic packaging, materials and processes : proceedings of ASM's 2nd Electronic Packaging: Materials and Processes Conference, Bloomington, Minnesota, 29-31 October 1985 : also includes selected papers from the 1st Electronic Packaging Conference, St. Paul, Minnesota, 21-23 August 1984 / edited by J.A. Sartell ; sponsored by ASM's Electronic Materials and Processing Division.
- Text
- [Metals Park, Ohio] : ASM, c1986.
- 1986
- 1 Item
Item details Format Call Number Item Location Text JSF 88-1071 Offsite Electronic packaging and corrosion in microelectronics : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987 / edited by Morris E. Nicholson ; sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota Chapter of ASM International ; supported by Twin City Section of NACE, IEEE Reliability Society, IEEE Components, Hybrids and Manufacturing Technology Society.
- Text
- [S.l.] : ASM International, c1987.
- 1987
- 1 Item
Item details Format Call Number Item Location Text JSF 88-1912 Offsite Electronic packaging materials science II / editors, K.A. Jackson ... [et al.].
- Text
- Pittsburgh, PA : Materials Research Society, c1986.
- 1986
- 1 Item
Item details Format Call Number Item Location Text JSE 87-1667 Offsite The Packaging of power semiconductor devices / C.A. Neugebauer ... [et al.].
- Text
- New York : Gordon and Breach Science Publishers, c1986.
- 1986
- 1 Item
Item details Format Call Number Item Location Text JSE 87-1868 Offsite A Scientific guide to surface mount technology / by C. Lea.
- Text
- Ayr, Scotland : Electrochemical Publications, 1988.
- 1988
- 1 Item
Item details Format Call Number Item Location Text JSE 88-584 Offsite Handbook of electronics packaging design and engineering / Bernard S. Matisoff.
- Text
- New York : Van Nostrand Reinhold, c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSE 90-1257 Offsite Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor.
- Text
- Washington, DC : American Chemical Society, 1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JSE 89-1584 Offsite Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. / editors, Ralph Jaccodine, Kenneth A. Jackson, Robert C. Sundahl.
- Text
- Pittsburgh, Pa. : Materials Research Society, c1988.
- 1988
- 1 Item
Item details Format Call Number Item Location Text JSE 89-24 Offsite Electronic materials handbook / prepared under the direction of the ASM International Handbook Committee ; Merrill L. Minges, technical chairman.
- Text
- Materials Park, OH : ASM International, 1989-
- 1989-present
- 1 Item
Item details Format Call Number Item Location Text JSK 90-99 v. 1 Offsite Journal of electronic packaging [microform].
- Text
- New York, N.Y. : American Society of Mechanical Engineers, 1989-
- 1989-present
- 16 Items
Item details Format Call Number Item Location Text *ZAN-V1666 v. 125 2003 Offsite Item details Format Call Number Item Location Text JSM 03-104 v. 127-v. 130, no. 1-2 (Dec. 2005-June 2008) Offsite Item details Format Call Number Item Location Text JSM 03-104 v. 130, no. 3-4-v. 131 (Sept. 2008-Dec. 2009) Offsite Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A. / editors, Ralph Jaccodine ... [et al.].
- Text
- Pittsburgh, Pa. : Materials Research Society, c1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JSE 91-389 Offsite Ceramic substrates and packages for electronic applications / edited by Man F. Yan ... [et al.].
- Text
- Westerville, Ohio : American Ceramic Society, c1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JSE 91-535 Offsite Surface mount and related technologies / Gerald Ginsberg.
- Text
- New York : M. Dekker, c1989.
- 1989
- 1 Item
Item details Format Call Number Item Location Text JFE 91-2738 Schwarzman Building - General Research Room 315 Available - Can be used on site. Please visit New York Public Library - Schwarzman Building to submit a request in person.
Plastic packaging of microelectronic devices / Louis T. Manzione.
- Text
- New York : Van Nostrand Reinhold, c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSE 91-1582 Offsite Packaging of electronic systems : a mechanical engineering approach / James W. Dally.
- Text
- New York : McGraw-Hill, c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSE 91-1552 Offsite Handbook of polymer coatings for electronics : chemistry, technology, and applications / by James J. Licari, Laura A. Hughes.
- Text
- Park Ridge, N.J., U.S.A. : Noyes Publications, c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSE 91-1524 Offsite Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A. / editors, Andrew T. Barfknecht ... [et al.].
- Text
- Pittsburgh, Pa. : Materials Research Society, c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSE 91-2124 Offsite Handbook of electronic package design / edited by Michael Pecht.
- Text
- New York : Marcel Dekker, c1991.
- 1991
- 1 Item
Item details Format Call Number Item Location Text JSF 91-911 Offsite Packaging engineering resources : an annotated compendium / Richard S. Hanes.
- Text
- Lancaster, Pa. : Technomic Pub. Co., c1990.
- 1990
- 1 Item
Item details Format Call Number Item Location Text JSF 92-444 Offsite The International journal of microcircuits and electronic packaging.
- Text
- Reston, VA : International Society for Hybrid Microelectronics, 1992-[2002?]
- 1992-2002
- 9 Items
Item details Format Call Number Item Location Text JSM 93-92 v. 23 (2000) Offsite Item details Format Call Number Item Location Text JSM 93-92 v. 24 (2001) Offsite Item details Format Call Number Item Location Text JSM 93-92 v. 25:1 (2002) Offsite Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. / editors, Edwin D. Lillie ... [et al.]
- Text
- Pittsburgh, Pa. : Materials Research Society, c1991.
- 1991
- 1 Item
Item details Format Call Number Item Location Text JSE 92-1803 Offsite Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief.
- Text
- New York : McGraw-Hill, c1991.
- 1991
- 1 Item
Item details Format Call Number Item Location Text JSE 92-2073 Offsite Proceedings, 1993 IEEE Multi-Chip Module Conference, MCMC-93 : March 15-18, 1993, Santa Cruz, California / sponsored by IEEE Circuits and Systems Society ... [et al.].
- Text
- Los Alamitos, Calif. : IEEE Computer Society Press, c1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text JSF 93-624 Offsite Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A. / editors, Paul S. Ho ... [et al.].
- Text
- Pittsburgh, Pa. : Materials Research Society, c1992.
- 1992
- 1 Item
Item details Format Call Number Item Location Text JSE 93-1816 Offsite Electronic packaging and production [microform].
- Text
- [Chicago, M. S. Kiver Publications].
- unknown-present
- 11 Items
Item details Format Call Number Item Location Text JSM 04 10 v. 41 2001 Offsite Item details Format Call Number Item Location Text JSM 04 10 v. 42 2002 Offsite Item details Format Call Number Item Location Text JSM 04-10 v. 43, no. 1-6 (Jan.-June 2003) Offsite Electronics packaging forum / edited by James E. Morris
- Text
- New York, N.Y. : Van Nostrand Reinhold, 1990-
- 2 Items
Item details Format Call Number Item Location Text JSK 91-95 v. 1 Offsite Item details Format Call Number Item Location Text JSK 91-95 v. 2 Offsite Micro system technologies 92 / 3rd International Conference on Micro, Electro, Opto, Mechanic Systems and Components, Berlin, October 21-23, 1992 ; Herbert Reichl, Editor.
- Text
- Berlin : vde-Verlag, c1992.
- 1992
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1128 Offsite Surface mount technology for concurrent engineering and manufacturing / Frank Classon.
- Text
- New York : McGraw-Hill, c1993.
- 1993
- 1 Item
Item details Format Call Number Item Location Text JSE 94-1239 Offsite Journal of electronics manufacturing.
- Text
- London : Chapman & Hall, c1991-2000.
- 1991-2000
- 4 Items
Item details Format Call Number Item Location Text JBM 96-670 v. 7 (1996) Schwarzman Building - General Research Room 315 Available - Can be used on site. Please visit New York Public Library - Schwarzman Building to submit a request in person.
Item details Format Call Number Item Location Text JBM 96-670 v. 8 (1998) Schwarzman Building - General Research Room 315 Available - Can be used on site. Please visit New York Public Library - Schwarzman Building to submit a request in person.
Item details Format Call Number Item Location Text JBM 96-670 v. 9-10 (1999-2000) Schwarzman Building - General Research Room 315 Available - Can be used on site. Please visit New York Public Library - Schwarzman Building to submit a request in person.
Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A. / editors, Peter Børgesen,Klavs F. Jensen, Roger A. Pollak.
- Text
- Pittsburgh, Pa. : Materials Research Society, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSE 95-739 Offsite Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / [edited by] Michael Pecht.
- Text
- New York : Wiley, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSE 94-1207 Offsite Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.].
- Text
- New York : Wiley, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1391 Offsite Physical design for multichip modules / by M. Sriram, S.M. Kang.
- Text
- Boston : Kluwer Academic Publishers, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSE 94-1864 Offsite Plastics for electronics : materials, properties, and design applications / William M. Alvino.
- Text
- New York : McGraw-Hill, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1383 Offsite Multichip module design, fabrication, and testing / James J. Licari.
- Text
- New York : McGraw-Hill, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1865 Offsite Physical architecture of VLSI systems / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.
- Text
- New York : Wiley, c1994.
- 1994
- 1 Item
Item details Format Call Number Item Location Text JSE 95-377 Offsite Proceedings of the technical program.
- Text
- Chicago, Ill. : Industrial and Scientific Conference Management
- 1963-198
- 11 Items
Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1976 Offsite Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1979 Offsite Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1981 Offsite Proceedings of the technical program / National Electronic Packaging and Production Conference.
- Text
- Des Plaines, IL : Cahners Exposition Group
- unknown-present
- 1 Item
Item details Format Call Number Item Location Text TTFA (National Electronic Packaging and Production Conference. Proceedings of the technical program) 1985 Offsite IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society.
- Text
- New York, NY : Institute of Electrical and Electronics Engineers, c1994-c1998.
- 1994-present
- 3 Items
Item details Format Call Number Item Location Text JSM 95-488 v. 17-18 (1994-1995) Offsite Item details Format Call Number Item Location Text JSM 95-488 v. 19 (1996) Offsite Item details Format Call Number Item Location Text JSM 95-488 v. 20-21 (1997-1998) Offsite Materials for electronic packaging / edited by Deborah D.L. Chung.
- Text
- Boston : Butterworth-Heinemann, c1995.
- 1995
- 1 Item
Item details Format Call Number Item Location Text JSE 95-1272 Offsite Air cooling technology for electronic equipment / edited by Sung Jin Kim, Sang Woo Lee.
- Text
- Boca Raton, Fla. : CRC Press, c1996.
- 1996
- 1 Item
Item details Format Call Number Item Location Text JSE 96-1057 Offsite 1st 1997 IEMT/IMC Symposium : April 16-18, 1997, Sonic City-Omiya, Tokyo, Japan / sponsored by IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society [and] SHM: The Microelectronics Society--Japan.
- Text
- Tokyo, Japan : Organizing Committee, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSF 97-451 Offsite Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium : October 13-15, 1997, Austin, TX USA / [sponsored by Semiconductor Equipment and Materials International (SEMI) and by the Components, Packaging, & Manufacturing Technology (CPMT) Society].
- Text
- [New York, N.Y.] : IEEE ; Piscataway, NJ : IEEE Service Center, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSF 97-635 Offsite High performance design automation for multi-chip modules and packages / editor, Jun-Dong Cho ; co-editor, Paul D. Franzon.
- Text
- Singapore ; River Edge, NJ : World Scientific, c1996.
- 1996
- 1 Item
Item details Format Call Number Item Location Text JSF 97-331 Offsite Electronic packaging of high speed circuitry / Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr.
- Text
- New York ; London : McGraw-Hill, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text JSE-97-924 Offsite Failure modes and mechanisms in electronic packages / Puligandla Viswanadham, Pratap Singh.
- Text
- New York : Chapman & Hall, c1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text JSE 98-95 Offsite Thin film technology handbook / Aicha A.R. Elshabini-Riad, Fred D. Barlow III.
- Text
- New York ; London : McGraw-Hill, c1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text JSE 98-477 Offsite Electronic packaging : design, materials, process, and reliability / John Lau...[et al.]
- Text
- New York : McGraw-Hill, c1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text JSE 98-658 Offsite
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